Research Achievements - Original paper -

Bending Strength of Cast Materials Reinforced with Hard Particles

S. Aso, H. Ike, K. Ohguchi, Y. Komastu and N. Konishi

Key Engineering Materials   457   404 - 409   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

K. Ohguchi and K. Sasaki

Transactions of the ASME, Journal of Electronic Packaging   132 ( 4 ) 041003-1 - 041003-7   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

K. Ohguchi and K. Sasaki

Transactions of the ASME, Journal of Electronic Packaging   132 ( 4 ) 041010-1 - 041010-7   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Electrochemical Preparation and Mechanical Properties of Dog-Bone Cu Foils

E. Tada, K. Ohguchi, G. Musha, K. Hadehara and Y. Miura

Electrochemistry   78 ( 2 ) 153 - 156   2010.02  [Refereed]

Research paper (journal)   Domestic Co-author

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

K. Ohguchi, K. Sasaki and S. Aso

Transactions of the ASME, Journal of Electronic Packaging   131 ( 2 ) 021003-1 - 021003-7   2009.06  [Refereed]

Research paper (journal)   Domestic Co-author

Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging

T. Kobayashi, K. Sasaki, K. Ohguchi and Y. Narita

Key Engineering Materials   345-346   97 - 100   2007.08

Research paper (journal)   Domestic Co-author

Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

K. Sasaki, T. Kobayashi and K. Ohguchi

Transactions of the ASME, Journal of Electronic Packaging   129 ( 1 ) 82 - 89   2007.03  [Refereed]

Research paper (journal)   Domestic Co-author

Ratchetting and Creep Deformation of Solder Alloys

T. Kobayashi,K. Sasaki,K. Ohguchi and Y. Narita

Key Engineering Materials   340-341   859 - 864   2007.01  [Refereed]

Research paper (journal)   Domestic Co-author

A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead- Containing Solder Alloys

K. OHGUCHI, K. SASAKI and M. ISHIBASHI

Journal of Electronic Materials   35 ( 1 ) 132 - 139   2006.01

Research paper (journal)  

Wear resistance of aluminum bearing alloys containing high concentration of tin under boundary lubrication

  55 ( 2 ) 57 - 62   2005.02  [Refereed]

Research paper (journal)   Domestic Co-author

Wear Behavior of Graphite-Dispersed Al-Sn-Si Alloys

M. Tagami, A. Sugafuji, Y. Yabumoto, K. Ohguchi, A. Muto

Materials Science Forum   449-452   629 - 632   2004.04  [Refereed]

Research paper (journal)   Domestic Co-author

Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-free Solders

K. OHGUCHI, K. SASAKI, M. ISHIBASHI, and T. HOSHINO

JSME International Journal Series A   47   371 - 379   2004.01

Research paper (journal)  

Elastic-Plastic-Creep Simulation of Pb/Sn Solder Alloys by Separation of Plastic and Creep

K. Ohguchi, K. Sasaki

JSME International Journal Series A   46 ( 4 ) 559 - 566   2003.07  [Refereed]

Research paper (journal)   Domestic Co-author

Wear Resistance of Al-Si-Cu and Al-Mg Casting Alloys

M. Tagami, A. Sugafuji, Y. Sone, K. Ohguchi, A. Muto, K. Sasaki

International Journal of Materials and Product Technology Special Issue   2   586 - 591   2001.08  [Refereed]

Research paper (journal)   Domestic Co-author

Viscoplastic Deformation of 40Pb/60Sn Solder Alloys -Experiments and Constitutive Modeling-

K. Sasaki, K. Ohguchi, H. Ishikawa

Transactions of ASME, Journal of Electronic Packaging   Vol. 123, 379-387   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys

K. Ohguchi, K. Sasaki

JSME International Journal Series A   Vol. 44, p.82-88 ( 1 ) 82 - 88   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Viscoplastic Deformation of Sn-3.5Ag-0.75Cu Solder Alloys

K. Sasaki, K. Ohguchi, A. Yanagimoto, H. Ishikawa

Material Science Research International, Special Technical Publication   2   397 - 402   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Prediction of fatigue failure of 60Sn-40Pb solder using constitutive model for cyclic viscoplasticity(共著)

H. Ishikawa, K. Sasaki, K. Ohguchi

Transactions of the American Society of Mechanical Engineers Journal of Electronic Packaging   118 ( 3 ) 164 - 169   1996.09  [Refereed]

Research paper (journal)   Domestic Co-author

Prediction of fatigue failure of 60Sn-40Pb solder using constitutive equation for cyclic viscoplasticity(共著)

H. Ishikawa, K. Sasaki, K. Ohguchi

Applied Mechanichs Division   187   83 - 90   1994.01  [Refereed]

Research paper (journal)   Domestic Co-author