Research Achievements - Original paper -

Derivation of fatigue damage law for an aluminum alloy based on plastic-creep separation strain analysis

Towa Hayashibe, Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Shinya Honda, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato, Nobuaki Shinya

International Journal of Fatigue ( Elsevier )  198   108964   2025.03  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

A material constants estimation method for efficient elastic–plastic–creep simulation of aluminum alloys by effective utilization of stored test data

Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato and Nobuaki Shinya

Mechanics of Time-Dependent Materials ( Springer Nature )  26 ( 4 )   2022.11  [Refereed]

Research paper (journal)   Domestic Co-author

アルミニウム合金製の自動車エンジン部品の耐疲労性は，弾・塑性・クリープ有限要素解析（FEA）を実行して評価する必要がある。そのためには，引張試験に加えて，長時間におよぶクリープ試験を実施してFEA用の材料定数を決定しなければならない。しかし，長時間におよぶ試験の実施は，製品開発において大きな障害となる。そこで，アルミニウム合金製自動車部品の性能評価試験などの結果を解析して，クリープ試験を行わずに弾・塑性・クリープFEA用の材料定数を導出することを試みた。その結果，この方法により導出した材料定数を用いれば，熱負荷と機械負荷を同時に受ける疲労負荷のシミュレーションが可能であることが判明した。

DOI

Evaluation of high-temperature fatigue life of aluminium alloys using plastic-creep separation method

Kohei FUKUCHI, Ken-ichi OHGUCHI, Katsuhiko SASAKI, Yorimasa TSUBOTA, Takuro MITA, Wataru NAGAI, Kouji OHSATO and Nobuaki SHINYA

Transactions of the JSME     2021.02  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

Evaluation of material nonlinearity of Cu/Sn IMCs based on FEA of shear test using copper-solder joints

Kengo KUROSAWA, Ken-ichi OHGUCHI, Kohei FUKUCHI and Atsuko TAKITA

Quarterly Journal of the Japan Welding Society ( JAPAN WELDING SOCIETY )  38 ( 4 ) 429 - 437   2020.12  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

Synthesis and Mechanical Properties of AlN–WC Ceramics

akashi SEKINE, Akihiro NINO, Yasushi SUGAWARA, Shigeaki SUGIYAMA, Ken-ichi OHGUCHI and Hitoshi TAIMATSU

Journal of the Japan Society of Powder and Powder Metallurgy ( Japan Society of Powder and Powder Metallurgy )  67 ( 10 ) 581 - 587   2020.10  [Refereed]

Research paper (journal)   Single author

DOI

Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading

K. OHGUCHI, K. SASAKI, Y. YUZE, K. FUKUCHI

Mechanical Engineering Journal   6 ( 5 ) 1 - 11   2019.08  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

Deformation Behavior of Pure Copper Castings with As-Cast Surfaces for Electrical Parts

I. Goto, S. Aso, K. Ohguchi, K. Kurosawa, H. Suzuki, H. Hayashi, J. Shionoya

Journal of Materials Engineering and Performance   28 ( 7 ) 3835 - 3843   2019.07  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

Development of Casting Educational Tool using Frozen Oil Cray Mold

  67 ( 3 ) 27 - 32   2019.03  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

Effect of Joining Conditions on the Shear Strength of Barium Titanate Joint Brazed with Molten Aluminum

Ikuzo Goto, Setsuo Aso and Ken-ichi Ohguchi

Materials Transactions   58 ( 8 ) 1175 - 1180   2017.06  [Refereed]

Research paper (journal)   Domestic Co-author

Factors Influencing Deformation Behavior and Electrical Conductivity of Pure Copper Castings Fabricated by Industrial Process

Ikuzo Goto, Setsuo Aso, Ken-ichi Ohguchi, Hayato Oguri, Kengo Kurosawa, Hiroyuki Suzuki, Hiroyuki Hayashi, Jun-ichi Shionoya

Journal of Japan Institute of Metals and Materials   81 ( 3 ) 133 - 142   2017.03  [Refereed]

Research paper (journal)   Domestic Co-author

Evaluation of the Stress Distribution by the Stepped Load Indentation Test with Constant Depth

A. Takita, K. Sasaki, K. Ohguchi and H. Fujiki

Key Engineering Materials   725   293 - 298   2016.12  [Refereed]

Research paper (journal)   Domestic Co-author

　圧子押込みと圧子位置の保持を繰返す，階段負荷インデンテーションの有限要素解析による数値試験を実施し，その結果に基づいて応力-ひずみ曲線を導出する方法について検討した。その結果，最大主応力が生じた面の近似球面の面積で圧子押込み時の荷重を除せば，その間の応力変化を適切に得られることが判明した。特に，最終押込み過程では，はんだの引張強さに相当する応力を得ることができた。今後，応力を算出した球面で生じるひずみを押込み深さの変化から算出する方法が確立できれば，インデンテーション試験で応力-ひずみ曲線の導出が可能になる。

DOI

Biaxial Ratchetting Deformation of Solders Considering Halt Conditions

Y. Tomizawa, T. Suzuki, K. Sasaki, K. Ohguchi and D. Echizenya

Key Engineering Materials   725   299 - 304   2016.12  [Refereed]

Research paper (journal)   Domestic Co-author

　近年，電子機器の強度信頼性を超加速限界試験(HALT：Highly Accelerated Limit Test)で評価することが行われ始めている。しかし，電子機器の強度信頼性を左右するはんだ接続部の変形が，熱負荷に機械的負荷が重畳されるHALTでどのように生じるかが解明されていないため，HALTは実験的にも理論的な裏付けが乏しい試験法とされている。そこで，この問題解決の第一段階として，複数の負荷が重畳されたときのはんだ接続部の基本的な変形・疲労挙動を調査した。すなわち，銅-はんだ接合体に繰返しねじりと応力変動を伴う軸方向負荷を同時に与える疲労試験を実施した。その結果，はんだ接続部は二軸ラチェットひずみの発生により疲労破壊に至り，二軸ラチェットひずみの発生量は軸方向負荷の応力変動により増大することが判明した。

DOI

Estimation of Plastic and Creep Strain Development of SAC Solder

K. Ohguchi and K. Sasaki

Key Engineering Materials   725   305 - 310   2016.12  [Refereed]

Research paper (journal)   Domestic Co-author

　先に提案した，繰返し負荷中の塑性・クリープひずみの発達挙動を階段波負荷で解析する方法の妥当性を検証した。すなわち，周期とひずみ振幅が同一の高速引張・低速圧縮(Fast-Slow)と低速引張・高速圧縮(Slow-Fast)でSn-3.0Ag-0.5Cu(SAC) 鉛フリーはんだの疲労試験を実施し，塑性・クリープひずみの発達挙動の解析結果と破面観察の結果の対応を調査することで，階段波負荷を用いたひずみ解析方法の妥当性について検討した。ひずみ発達挙動の解析結果は，Fast-Slowでは塑性ひずみの引張側への蓄積による疲労破壊が，Slow-Fastではクリープひずみの引張側への蓄積による疲労破壊が生じたことを示すものであった。Fast-Slowの破面では塑性変形に起因する疲労であったことを示すストライエーションがみられた。一方，Slow-Fastの破面ではクリープ変形に起因する疲労であったことを示す粒界破壊による顕著な凹凸がみられた。これらの破面観察の結果は，ひずみ解析結果と対応することから，階段波負荷を用いたひずみ解析法の妥当性が示された。

DOI

An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

K. Ohguchi and K. Kurosawa

Journal of Electronic Materials   45 ( 6 ) 3183 - 3191   2016.05  [Refereed]

Research paper (journal)   Domestic Co-author

DOI

A Method to Evaluate Creep Properties of Solder Alloys Using Micro Indentation

K. Sasaki, K. Ohguchi and A. Takita

Advanced Structure Materials ― From Creep Damage Mechanics to Homogenization Methods ―   64   335 - 356   2015.09  [Refereed]

Research paper (journal)   Domestic Co-author

An Effective Area Considering the Principal Stress to Evaluate Creep Strain Measured by Indentation Test

A. Takita, K. Sasaki, K. Ohguchi and R. Takeda

Experimental Mechanics   55 ( 6 ) 1081 - 1091   2015.07  [Refereed]

Research paper (journal)   Domestic Co-author

A Method to Identify Steady Creep Strain from Indentation Creep Using a New Reference Area of Indentation

A. Takita, K. Sasaki and K. Ohguchi

Journal of Electronic Materials   43 ( 7 ) 2530 - 2539   2014.07  [Refereed]

Research paper (journal)   Domestic Co-author

Viscoplastic Constitutive Model to Divide Inelastic Strain into Time-Independent and Time-Dependent Strains

K. Ohguchi and K. Sasaki

Advanced Structured Materials, Structured Materials, Advanced Materials Modelling for Structures   19   285 - 296   2013.04  [Refereed]

Research paper (journal)   Domestic Co-author

Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model

K. Sasaki and K. Ohguchi

Journal of Electronic Materials   40 ( 12 )   2011.12  [Refereed]

Research paper (journal)   Domestic Co-author

Constitutive Modeling for SAC Lead-Free Solder Based on Cyclic Loading Tests Using Stepped Ramp Waves

K. Ohguchi and K. Sasaki

Procedia Engineering   10   1139 - 1144   2011.06  [Refereed]

Research paper (journal)   Domestic Co-author

Bending Strength of Cast Materials Reinforced with Hard Particles

S. Aso, H. Ike, K. Ohguchi, Y. Komastu and N. Konishi

Key Engineering Materials   457   404 - 409   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

K. Ohguchi and K. Sasaki

Transactions of the ASME, Journal of Electronic Packaging   132 ( 4 ) 041003-1 - 041003-7   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

K. Ohguchi and K. Sasaki

Transactions of the ASME, Journal of Electronic Packaging   132 ( 4 ) 041010-1 - 041010-7   2010.12  [Refereed]

Research paper (journal)   Domestic Co-author

Electrochemical Preparation and Mechanical Properties of Dog-Bone Cu Foils

E. Tada, K. Ohguchi, G. Musha, K. Hadehara and Y. Miura

Electrochemistry   78 ( 2 ) 153 - 156   2010.02  [Refereed]

Research paper (journal)   Domestic Co-author

Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

K. Ohguchi, K. Sasaki and S. Aso

Transactions of the ASME, Journal of Electronic Packaging   131 ( 2 ) 021003-1 - 021003-7   2009.06  [Refereed]

Research paper (journal)   Domestic Co-author

Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging

T. Kobayashi, K. Sasaki, K. Ohguchi and Y. Narita

Key Engineering Materials   345-346   97 - 100   2007.08

Research paper (journal)   Domestic Co-author

Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys

K. Sasaki, T. Kobayashi and K. Ohguchi

Transactions of the ASME, Journal of Electronic Packaging   129 ( 1 ) 82 - 89   2007.03  [Refereed]

Research paper (journal)   Domestic Co-author

Ratchetting and Creep Deformation of Solder Alloys

T. Kobayashi,K. Sasaki,K. Ohguchi and Y. Narita

Key Engineering Materials   340-341   859 - 864   2007.01  [Refereed]

Research paper (journal)   Domestic Co-author

A Quantitative Evaluation of Time-Independent and Time-Dependent Deformations of Lead-Free and Lead- Containing Solder Alloys

K. OHGUCHI, K. SASAKI and M. ISHIBASHI

Journal of Electronic Materials   35 ( 1 ) 132 - 139   2006.01

Research paper (journal)  

Wear resistance of aluminum bearing alloys containing high concentration of tin under boundary lubrication

  55 ( 2 ) 57 - 62   2005.02  [Refereed]

Research paper (journal)   Domestic Co-author

Wear Behavior of Graphite-Dispersed Al-Sn-Si Alloys

M. Tagami, A. Sugafuji, Y. Yabumoto, K. Ohguchi, A. Muto

Materials Science Forum   449-452   629 - 632   2004.04  [Refereed]

Research paper (journal)   Domestic Co-author

Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-free Solders

K. OHGUCHI, K. SASAKI, M. ISHIBASHI, and T. HOSHINO

JSME International Journal Series A   47   371 - 379   2004.01

Research paper (journal)  

Elastic-Plastic-Creep Simulation of Pb/Sn Solder Alloys by Separation of Plastic and Creep

K. Ohguchi, K. Sasaki

JSME International Journal Series A   46 ( 4 ) 559 - 566   2003.07  [Refereed]

Research paper (journal)   Domestic Co-author

Wear Resistance of Al-Si-Cu and Al-Mg Casting Alloys

M. Tagami, A. Sugafuji, Y. Sone, K. Ohguchi, A. Muto, K. Sasaki

International Journal of Materials and Product Technology Special Issue   2   586 - 591   2001.08  [Refereed]

Research paper (journal)   Domestic Co-author

Viscoplastic Deformation of 40Pb/60Sn Solder Alloys -Experiments and Constitutive Modeling-

K. Sasaki, K. Ohguchi, H. Ishikawa

Transactions of ASME, Journal of Electronic Packaging   Vol. 123, 379-387   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys

K. Ohguchi, K. Sasaki

JSME International Journal Series A   Vol. 44, p.82-88 ( 1 ) 82 - 88   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Viscoplastic Deformation of Sn-3.5Ag-0.75Cu Solder Alloys

K. Sasaki, K. Ohguchi, A. Yanagimoto, H. Ishikawa

Material Science Research International, Special Technical Publication   2   397 - 402   2001.01  [Refereed]

Research paper (journal)   Domestic Co-author

Prediction of fatigue failure of 60Sn-40Pb solder using constitutive model for cyclic viscoplasticity(共著)

H. Ishikawa, K. Sasaki, K. Ohguchi

Transactions of the American Society of Mechanical Engineers Journal of Electronic Packaging   118 ( 3 ) 164 - 169   1996.09  [Refereed]

Research paper (journal)   Domestic Co-author

Prediction of fatigue failure of 60Sn-40Pb solder using constitutive equation for cyclic viscoplasticity(共著)

H. Ishikawa, K. Sasaki, K. Ohguchi

Applied Mechanichs Division   187   83 - 90   1994.01  [Refereed]

Research paper (journal)   Domestic Co-author