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Affiliation |
Graduate School of Engineering Science Department of Materials Science Materials Science and Engineering Course |
FUKUCHI Kohei
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Research Interests 【 display / non-display 】
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Mechanical material
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Metal matrix composite
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Strength of materials
Graduating School 【 display / non-display 】
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-2007.03
Hokkaido University Graduated
Graduate School 【 display / non-display 】
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-2013.03
Hokkaido University Graduate School,Division of Engineering Doctor's Degree Program Completed
Campus Career 【 display / non-display 】
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2020.04-Now
Akita University Graduate School of Engineering Science Department of Materials Science Materials Science and Engineering Course Assistant Professor
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2017.12-2020.03
Akita University Graduate School of Engineering Science Department of Materials Science Materials Science and Engineering Course Specially-appointed Assistant Professor
Research Areas 【 display / non-display 】
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Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Mechanics of materials and materials
Thesis for a degree 【 display / non-display 】
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Study on Thermal and Strength Properties of Aluminum Based Thermal Conductive Composites Containing VGCF-CNT Filler
FUKUCHI Kohei
2013.03 [Refereed]
Single author
Research Achievements 【 display / non-display 】
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A material constants estimation method for efficient elastic–plastic–creep simulation of aluminum alloys by effective utilization of stored test data
Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato and Nobuaki Shinya
Mechanics of Time-Dependent Materials ( Springer Nature ) 26 ( 4 ) 2022.11 [Refereed]
Research paper (journal) Domestic Co-author
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FUKUCHI Kohei, OHGUCHI Ken-ichi, SASAKI Katsuhiko, TSUBOTA Yorimasa, MITA Takuro, NAGAI Wataru, OHSATO Kouji, SHINYA Nobuaki
Transactions of the JSME (in Japanese) ( The Japan Society of Mechanical Engineers ) 2021.03 [Refereed]
Research paper (journal) Domestic Co-author
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KUROSAWA Kengo, OHGUCHI Ken-ichi, FUKUCHI Kohei, TAKITA Atsuko
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ( JAPAN WELDING SOCIETY ) 38 ( 4 ) 429 - 437 2020.12 [Refereed]
Research paper (journal) Domestic Co-author
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TAKAHASHI Tsuyoshi, TANAKA Koki, NGUYEN Son Thanh, FUKUCHI Kohei
JOURNAL OF JAPAN SOCIETY FOR DESIGN ENGINEERING ( Japan Society for Design Engineering ) 55 ( 7 ) 443 - 450 2020.07 [Refereed]
Research paper (journal) Domestic Co-author
<p>CAE came to be used as the main developing tool in the manufacturing industry in Japan. Thereby the process in this way was changed greatly by CAE. As the background, Designer's CAE has generally carried out since CAE software has been usually provided with the integrated CAD. However, the precise analytical methods constructed by CAE specialists must be simplified because designers use an ordinary PC which has not enough performance for CAE, and they do not have special techniques to conduct the precise analytical methods. On the other hand, as a social problem, it has been issued how to effectively use the massive disposal of Japanese larch thinnings. The authors have been researched the feasibility of construction timbers manufactured by compressing Japanese larch thinnings. The purpose of this study is to develop a simplified analytical method without using non-linear ones for evaluation of the vibration characteristics of a whole wooden house. The simulation results obtained by the simplified analytical method are in good agreement with the experimental results at low order modes. In addition, it was found that the bending Young's modulus of a compressed wood that was manufactured from the Japanese larch thinning becomes high in proportional to the compression ratio. The reason is that fiber density increase high according to a compression ratio. Moreover, it became clear that the appropriate arrangement of compressed wood can improve the stiffness of the experimental wooden house from the simulation results.</p>
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Fatigue life estimation of SAC solder based on inelastic strain analysis using stepped ramp wave loading
Ken-ichi OHGUCHI, Katsuhiko SASAKI, Yuki YUZE, Kohei FUKUCHI
Mechanical Engineering Journal 6 ( 5 ) 1 - 11 2019.08 [Refereed]
Research paper (journal) Domestic Co-author
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Kohei FUKUCHI, Yasuyuki OKA, Mio SUZUKI, Hiroto OOMAE, Dai NOBORIGUCHI
Bulletin of National Institute of Technology, Kushiro College ( 51 ) 69 - 70 2018.01 [Refereed]
Meeting report etc. Domestic Co-author
◆Original paper【 display / non-display 】
◆Other【 display / non-display 】
Grant-in-Aid for Scientific Research 【 display / non-display 】
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Grant-in-Aid for Scientific Research(C)
Project Year： 2018.04 - 2021.03
Presentations 【 display / non-display 】
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An Efficient Parameter Estimation Method for Elastic-Plastic-Creep Simulation of Aluminum Alloys
Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato, Nobuaki Shinya
WCCM-APCOM 2022 2022.07 - 2022.08 International Association for Computational Mechanics (IACM) and The Japan Society for Computational Engineering and Science (JSCES)
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Thermal and Tensile Properties of Polyethylene Based Heat Storage Composite Containing Phase Change Material and Copper Sheet
Kohei FUKUCHI, Ken-ichi OHGUCHI, Kengo KUROSAWA, Katsuhiko SASAKI
Asia-Pacific Conference on Fracture and Strength 2020 2020.11 - 2020.11 Korean Society of Mechanical Engineers
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Indentation FEA Considering Material Non-linearity of Cu<sub>3</sub>Sn
KUROSAWA Kengo, OHGUCHI Ken-ichi, FUKUCHI Kohei, TAKITA Atsuko
The Proceedings of Mechanical Engineering Congress, Japan 2020.09 - 2020.09 The Japan Society of Mechanical Engineers
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FUKUCHI Kohei, OHGUCHI Kenichi, KUROSAWA Kengo, TAKITA Atsuko, Furusawa Akio
The Proceedings of Mechanical Engineering Congress, Japan 2020.09 - 2020.09 The Japan Society of Mechanical Engineers
<p>In next-generation power modules, the mounting of the power semiconductor chip using GaN and SiC, which can work in high-temperature environments over 200°C, is demanded. For the mounting, the lead-free solder with a melting point of around 200°C and high melting point solders containing harmful lead cannot be used. So in late years, the sinter bonding using Cu<sub>3</sub>Sn, which is a Cu/Sn intermetallic compound, attracts attention. For the practical use of the bonding, it is necessary to clarify the strength reliability of the Cu<sub>3</sub>Sn. Therefore, in this study, to evaluate the deformation properties of the Cu<sub>3</sub>Sn, a micro-indentation tests are carried out at temperature from room temperature to 200°C for a bulk sample of Cu<sub>3</sub>Sn made using the arc melting method. According to these results, Young's modulus and tensile strength of Cu<sub>3</sub>Sn in each temperature are estimated. And it is found that the amount of inelastic deformation increases with a rise in temperature.</p>
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Evaluation of Tensile Deformation Behavior of Alumite using Al Specimen Having Anodizing Layer
FUKUCHI Kohei, SHINYA Nobuaki, OHGUCHI Ken-ichi, OHMORI Takayuki, KUROSAWA Kengo, TSUBOTA Yorimasa, NAGAI Wataru, YAMADA Akinori, Masaka Hiroki, OHSATO Kouji
The Proceedings of the Materials and Mechanics Conference 2019.11 - 2019.11 The Japan Society of Mechanical Engineers
Academic Activity 【 display / non-display 】
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2021.11-Now
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2021.09-Now
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2021.04-Now
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2018.07-2019.05
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2018.04-2019.09