Details of a Researcher - FUKUCHI Kohei

Presentations -

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Fiber Orientation Mechanism of Aluminum-Based Composite Containing Short Carbon Fibers Having Anisotropic Thermal Conductivity Fabricated by Repeated Rolling and Annealing

Kohei FUKUCHI, Ken-ichi OHGUCHI, Kengo KUROSAWA and Atsuko TAKITA

14th Asia-Pacific Conference on Fracture and Strength (APCFS2024) 2024.11 - 2024.11 the Japan Society of Mechanical Engineers–Materials and Mechanics Division

Derivation of High-Temperature Fatigue Damage Rule for Aluminum Alloy Based on Plastic and Creep Strains Analysis Using Data Assimilation Technique

Towa HAYASHIBE, Katsuhiko SASAKI, Ken-ichi OHGUCHI, Kohei FUKUCHI, Yorimasa TSUBOTA, Takuro MITA, Wataru NAGAI, Kouji OHSATO, Nobuaki SHINYA

14th Asia-Pacific Conference on Fracture and Strength (APCFS2024) 2024.11 - 2024.11 the Japan Society of Mechanical Engineers–Materials and Mechanics Division

Characterization of low-cycle fatigue fracture surfaces of aluminum alloys at high temperature using fractal dimension analysis

Kohei FUKUCHI, Ken-ichi OHGUCHI, Towa HAYASHIBE, Katsuhiko SASAKI, Yorimasa TSUBOTA, Takuro MITA, Wataru NAGAI, Kouji OHSATO, Nobuaki SHINYA

13th International Fatigue Congress (FATIGUE2022+1) 2023.11 - 2023.11 the Society of Materials Science, Japan, Committee on Fatigue of Materials

Identification of Plastic-creep Fatigue Damage Rule for Aluminum Alloys Using Particle Swarm Optimization Method

Towa HAYASHIBE, Ken-ichi OHGUCHI, Kohei FUKUCHI, Katsuhiko SASAKI, Yorimasa TSUBOTA, Takuro MITA, Wataru NAGAI, Kouji OHSATO, Nobuaki SHINYA

13th International Fatigue Congress (FATIGUE2022+1) 2023.11 - 2023.11 the Society of Materials Science, Japan, Committee on Fatigue of Materials

An Efficient Parameter Estimation Method for Elastic-Plastic-Creep Simulation of Aluminum Alloys

Ken-ichi Ohguchi, Katsuhiko Sasaki, Kohei Fukuchi, Yorimasa Tsubota, Takuro Mita, Wataru Nagai, Kouji Ohsato, Nobuaki Shinya

WCCM-APCOM 2022 2022.07 - 2022.08 International Association for Computational Mechanics (IACM) and The Japan Society for Computational Engineering and Science (JSCES)

Effect of Rolling and Annealing Conditions on Thermal Conductive Property of Sintered Aluminium Containing Short Carbon Fiber

FUKUCHI Kohei, OHGUCHI Ken-ichi, KUROSAWA Kengo

The Proceedings of Mechanical Engineering Congress, Japan 2021 - 2021 The Japan Society of Mechanical Engineers

DOI

Thermal Deformation Analysis in Next-Generation Power Conductor Mounting Using Cu3Sn

TAKAYAMA Yukihiro, OHGUCHI Ken-ichi, FUKUCHI Kohei, KUROSAWA Kengo, FURUSAWA Akio

The Proceedings of Mechanical Engineering Congress, Japan 2021 - 2021 The Japan Society of Mechanical Engineers

DOI

Cyclic Deformation Characteristics of Cu3Sn Evaluated by Using Composite Copper Wire Specimen

OHGUCHI Ken-ichi, FUKUCHI Kohei, KUROSAWA Kengo, FURUSAWA Akio

The Proceedings of Mechanical Engineering Congress, Japan 2021 - 2021 The Japan Society of Mechanical Engineers

DOI

Thermal and Tensile Properties of Polyethylene Based Heat Storage Composite Containing Phase Change Material and Copper Sheet

Kohei FUKUCHI, Ken-ichi OHGUCHI, Kengo KUROSAWA, Katsuhiko SASAKI

Asia-Pacific Conference on Fracture and Strength 2020 2020.11 - 2020.11 Korean Society of Mechanical Engineers

Indentation FEA Considering Material Non-linearity of Cu3Sn

KUROSAWA Kengo, OHGUCHI Ken-ichi, FUKUCHI Kohei, TAKITA Atsuko

The Proceedings of Mechanical Engineering Congress, Japan 2020.09 - 2020.09 The Japan Society of Mechanical Engineers

DOI

Inelastic Deformation of Cu3Sn Bulk Specimen Under Micro-Indentation Testing and Its Temperature Dependency

FUKUCHI Kohei, OHGUCHI Kenichi, KUROSAWA Kengo, TAKITA Atsuko, Furusawa Akio

The Proceedings of Mechanical Engineering Congress, Japan 2020.09 - 2020.09 The Japan Society of Mechanical Engineers

In next-generation power modules, the mounting of the power semiconductor chip using GaN and SiC, which can work in high-temperature environments over 200°C, is demanded. For the mounting, the lead-free solder with a melting point of around 200°C and high melting point solders containing harmful lead cannot be used. So in late years, the sinter bonding using Cu3Sn, which is a Cu/Sn intermetallic compound, attracts attention. For the practical use of the bonding, it is necessary to clarify the strength reliability of the Cu3Sn. Therefore, in this study, to evaluate the deformation properties of the Cu3Sn, a micro-indentation tests are carried out at temperature from room temperature to 200°C for a bulk sample of Cu3Sn made using the arc melting method. According to these results, Young's modulus and tensile strength of Cu3Sn in each temperature are estimated. And it is found that the amount of inelastic deformation increases with a rise in temperature.

DOI

Effect of Shape and Distribution Morphology of Primary Tin Crystal on Tensile Strength of Miniature SAC Solder Specimen

OHGUCHI Ken-ichi, KAN Ken-ichiro, FUKUCHI Kohei, KUROSAWA Kengo, TAKITA Atsuko

The Proceedings of the Materials and Mechanics Conference 2019.11 - 2019.11 The Japan Society of Mechanical Engineers

DOI

Evaluation of Tensile Deformation Behavior of Alumite using Al Specimen Having Anodizing Layer

FUKUCHI Kohei, SHINYA Nobuaki, OHGUCHI Ken-ichi, OHMORI Takayuki, KUROSAWA Kengo, TSUBOTA Yorimasa, NAGAI Wataru, YAMADA Akinori, Masaka Hiroki, OHSATO Kouji

The Proceedings of the Materials and Mechanics Conference 2019.11 - 2019.11 The Japan Society of Mechanical Engineers

DOI

Mechanical Properties of Polyethylene Based Heat Storage Composite containing Phase Change Material and Copper Sheet

Kohei FUKUCHI, Ken-ichi OHGUCHI, Kengo KUROSAWA, Yuuki SUGIMOTO, Katsuhiko SASAKI

International Tehchnical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (ASME2019 InterPACK) 2019.10 - 2019.10 American Society of Mechanical Engineers

Development of Temperature Rise Prevention Material by compositing PCM, Polyethylene and Copper

SUGIMOTO Yuki, FUKUCHI Kohei, OHGUCHI Ken-ichi, KUROSAWA Kengo, SASAKI Katsuhiko